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Production Capability
 
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Big volume production
Small volume production
Layer Count 2-18 2-30
Laminates Style FR-4,FR-1,FR-2,CEM-1,CEM3,HB, High Tg, Halogen- Free, Rogers ,BT, Teflon, PTFE, Ceramic based, aluminum basedetc.
Mixed Lamination 4-6 layers 6-8 layers
Maximum Board Size 610mm X 1100mm

Profile Dimension Tolerance 0.13mm 0.10mm
Board Thickness 0.2mm--6.00mm 0.20mm--8.00mm
Thickness Tolerance ( t0.8mm) 8% 5%
Thickness Tolerance (t0.8mm) 10% 8%
Dielectric Thickness 0.076mm 0.076mm--0.100mm
Minimum Trace Width 0.12mm 0.1mm
Minimum Wire Spacing 0.1mm 0.075mm
Outer Layer Copper Thickness 8.75um--175um 8.75um--280um
Inner Layer Copper Thickness 17.5um--175um 8.75um--175um
Drilling Hole Dimension (CNC) 0.25mm--6.00mm 0.15mm--0.25mm
Finished Hole Dimension(CNC) 0.20mm--6.00mm 0.10mm--0.20mm
Drilling Diameter Tolerance(CNC) 0.05mm 0.05mm
Hole Position Tolerance(CNC) 0.075mm 0.050mm
Laser drilled Dimension 0.10mm 0.075mm
Aspect Ratio 10:1 12:1
Solder Mask Style Liquid Photo-Imageable: White, Green, Yellow, Black, Red, Blue, etc.
Minimum Solder Mask Dam 0.12mm 0.1mm
Minimum.Solder Mask Isolation Annular Ring 0.075mm 0.05mm
Plugged Hole Diameter 0.25mm--0.60mm 0.60mm-0.80mm
Impedance Tolerance 10% 5%
Surface Finish: Hot Air Solder Levelling (HASL), Electroless Nickel/Immersion Gold(ENIG), Immersion Silver, Ni/Au Plating, Gold Finger Plating, OSP, etc.
PCB Document Format GERBER, CAM350, PROTEL 99 SE, AUTOCAD, DXP, etc.
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