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You are here£ºHome > Production > Production Capability |
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Item |
Big volume production |
Small volume production |
| Layer Count |
2-18 |
2-30 |
| Laminates Style |
FR-4,FR-1,FR-2,CEM-1,CEM3,HB, High Tg, Halogen- Free, Rogers ,BT, Teflon, PTFE, Ceramic based, aluminum based£¬etc. |
| Mixed Lamination |
4-6 layers |
6-8 layers |
| Maximum Board Size |
610mm X 1100mm |
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| Profile Dimension Tolerance |
¡À0.13mm |
¡À0.10mm |
| Board Thickness |
0.2mm--6.00mm |
0.20mm--8.00mm |
| Thickness Tolerance ( t¡Ý0.8mm) |
¡À8% |
¡À5% |
| Thickness Tolerance (t£¼0.8mm) |
¡À10% |
¡À8% |
| Dielectric Thickness |
0.076mm |
0.076mm--0.100mm |
| Minimum Trace Width |
0.12mm |
0.1mm |
| Minimum Wire Spacing |
0.1mm |
0.075mm |
| Outer Layer Copper Thickness |
8.75um--175um |
8.75um--280um |
| Inner Layer Copper Thickness |
17.5um--175um |
8.75um--175um |
| Drilling Hole Dimension (CNC) |
0.25mm--6.00mm |
0.15mm--0.25mm |
| Finished Hole Dimension(CNC) |
0.20mm--6.00mm |
0.10mm--0.20mm |
| Drilling Diameter Tolerance(CNC) |
¡À0.05mm |
¡À0.05mm |
| Hole Position Tolerance(CNC) |
¡À0.075mm |
¡À0.050mm |
| Laser drilled Dimension |
0.10mm |
0.075mm |
| Aspect Ratio |
10:1 |
12:1 |
| Solder Mask Style |
Liquid Photo-Imageable: White, Green, Yellow, Black, Red, Blue, etc. |
| Minimum Solder Mask Dam |
0.12mm |
0.1mm |
| Minimum.Solder Mask Isolation Annular Ring |
0.075mm |
0.05mm |
| Plugged Hole Diameter |
0.25mm--0.60mm |
0.60mm-0.80mm |
| Impedance Tolerance |
¡À10% |
¡À5% |
| Surface Finish: |
Hot Air Solder Levelling (HASL), Electroless Nickel/Immersion Gold(ENIG), Immersion Silver, Ni/Au Plating, Gold Finger Plating, OSP, etc. |
| PCB Document Format |
GERBER, CAM350, PROTEL 99 SE, AUTOCAD, DXP, etc. |
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